Date Posted: April 04, 2017
Employment Type: Contract
Job Id: 7577
The responsibilities include but not limited to the following: Make sure that equipment is ready for Production per PROMIS and preflight check list. Run equipment qualification and tests run under Engineering Group Supervision. Process lots in timely manner according to PROMIS script and FCS instructions. Assist Engineering Group in Problems troubleshooting and resolution. Participates in process requirements identification, and process analysis, documentation and tracking. Assist with Design of Experiments for process cost & yield improvements.
Skills Required semiconductor process, photolithogrpahy and/or ebeam lithography, wetchem, drychem, metal and thin film, thinning.
Skills Preferred operation of Ultratec Stepper, contact aligner, ACS coater, CDSEM, ebeam evaporator, plasma sputtering, metal plating, plasma etching, grinding. SPC, DOE, Promis.
Experience Required: semiconductor process, wafer handling, clean room protocol
Experience Preferred: compound semiconductor processes with GaAs and GaN wafers.
Education Required: High School education
Education Preferred: 2-year degree
MUST BE US CITIZEN